***Thank You all for making the 10th IEEE MCSoC-16 a great success***

Latest News & Updates

  • Departure for guided tour : meeting point at 13:15 in front of the conference center, entrance H
  • Departure to Brasserie Le Sud: meeting point at 19:00 in front of the conference center, entrance H
  • View photos here !






  • September 9, 2016: The advance program is available.
  • June 26, 2016: Authors of selected papers will be invited to submit extended versions of their papers to Special Issue on Emerging Technologies and Architectures for Manycore Computing, IEEE Transactions on Multi-Scale Computing Systems. Submission deadline: December 1, 2016View Call for Papers.
  • June 25, 2016:  Author-kit  page is released. Camera-ready paper due date is on July 20, 2016.
  • June 23, 2016: Paper acceptance notification was extended to June 27, 2016.
  • March 31, 2016: Paper submission deadline was extended to April 30, 2016. This is a HARD deadline! 
  • Authors of selected papers from MCSoC-16 will be invited to submit extended versions of their works to a special issue for IEEE Transactions on Multi-Scale Computing Systems (more information coming soon).
  • March 11, 2016: Paper submission deadline was extended to March 31, 2016
  • March 11, 2016:  Five invited speakers  with innovative ideas will speak at the IEEE MCSoC-16.

 Call for Papers (.pdf)

The IEEE MCSoC-16 (10th International Symposium on Embedded Multicore/Many-core Systems-on-Chip) aims at providing the  world’s premier forum of leading  researchers in the embedded Multicore/Many-core SoCs software, tools and  applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works. Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon  acceptance of the paper.

Program Tracks

  1. Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
  2. Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
  3. Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
  4. Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
  5. Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
  6. Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
  7. Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
  8. Benchmarks: Parallel Benchmarks, Workload characterization and evaluation
  9. Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, and Consumer electronics.

Special Sessions

Important Dates

  • Paper Submission: March 31, April 30, 2016 (Hard Deadline).
  • Acceptance notification: June 24, 2016 –> June 27, 2016 (Extended)
  • Camera ready paper: July 15, 2016 –> July 20, 2016.
  • Symposium: September 21-23, 2016

Invited Speakers