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19th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC-2026)

Shanghai Jiao Tong University, Shanghai, China, December 14-17, 2026

URL: https://mcsoc-forum.org/
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The 19th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC?2026) aims to provide the world�fs premier forum for leading researchers in embedded multicore/manycore SoCs, software, tools, and application design across academia and industry.
Sponsored by IEEE and the IEEE Computer Society Technical Community on Microprocessors and Microcomputers (TCMM), MCSoC-2026 features keynote lectures, special sessions, and 19 specialized technical tracks. Key focus areas include heterogeneous architectures, energy-efficient computing, NoC technologies, neuromorphic and brain-inspired systems, and chiplet-based integration.

Organizing Committee

***Honorary Chairs
- Minyi Guo, Shanghai Jiao Tong University
- Hideharu Amano, Prefectural University of Kumamoto

***Conference Chairs
- Tee Hui Teo, Singapore University of Technology and Design
- Yongfu Li, Shanghai Jiao Tong University
- Xinfei Guo, Shanghai Jiao Tong University

***Local Arrangements Chairs
- Boxiao Liu, Fudan University
- Chao Wang, Shanghai Jiao Tong University

**Program Co-Chairs
- An Zou, Shanghai Jiao Tong University
- Md Farhadur Reza, Eastern Illinois University
- Hanzhi Ma, Zhejiang University

***Publicity Co-Chairs
- Jiale Yan, Li Auto Company
- Michael Meyer, Eastern Washington University
- Yehan Ma, Shanghai Jiao Tong University

***International Liaison
- Jason K. Eshraghian, UC Santa Cruz
- Fawaz Alazemi, Kuwait University

***Industry Advisory & Entrepreneurship Co?Chairs
- Jiajun Tu, Huawei
- Yan Xie, Li Auto Company

***Special Sessions & WSM Chair
- Zhishang Wang, University of Aizu

***Technical Tracks (19 Tracks)
- Programming Techniques for Embedded Multicore/Manycore SoCs
- Architectural Innovations in Embedded Multicore/Manycore SoCs
- Design Methodologies for Embedded Multicore/Manycore SoCs
- Interconnection Networks for Embedded Multicore/Manycore SoCs
- Testing, Security, and Trust in Embedded Multicore/Manycore Systems
- Design Automation and Low-Power Techniques for Embedded Manycore SoCs
- Real-Time Systems for Embedded Multicore/Manycore SoCs
- Operating System Platforms for Real-Time Embedded Applications
- Application Domains for Embedded Multicore/Manycore SoCs
- Hardware Acceleration of AI on Embedded Edge SoCs
- Machine Learning for Energy-Efficient and Reliable Manycore Systems
- Chiplet-Based Architectures and Design for Multicore SoCs
- Sustainable Design and Lifecycle Management for Multicore SoCs
- Privacy-Preserving AI Acceleration on Embedded Multicore SoCs
- Formal Verification and Benchmarking of Multicore SoC Platforms
- Compiler Technologies and Toolchains for Embedded Multicore SoCs
- Multicore SoCs for Cyber-Physical and Autonomous Systems
- 2026 MCSoC-NeuroCore Global Summit on Neuromorphic Systems and Brain-Inspired Computing

***Special Sessions
- Cutting-Edge Emerging Applications
- Embedded Applications and Ubiquitous Computing
- Embedded, Cyber-Physical, and IoT Systems
- Digital Accessibility through AI and ML
- Intelligent Mechatronics & Neuroprosthesis
- Quantum Technology and Machine Learning
- Optical Communications, Devices and Networking
- Emerging Technologies and Sustainability
- Emerging Machine Learning and Deep Learning
- Harnessing AI Tools for Transforming Education
- Embedded Machine Learning and Data Analytics
- Embedded Biomedical Engineering
- Parallel/Distributed, Grid, and Cloud Computing
- Distributed Computing & Communication Techniques for Emerging AI Applications
- Intelligent Systems and Learning Technologies

***Paper Submission & Deadlines
- Paper submission deadline: April 30, 2026
- Acceptance notification: July 20, 2026
- Camera-ready deadline: July 31, 2026
- Conference dates: December 14?17, 2026
- Submission system: https://edas.info/N34632

**Proceedings Publication & Indexing
All accepted papers (technical tracks, special tracks, special sessions, and workshops) will be published by IEEE Conference Proceedings, included in the IEEE Computer Society Digital Library (CSDL) and IEEE Xplore, and submitted for indexing to EI Compendex, Scopus, ISI Thomson, and others.