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News & Updates

  • August 18, 2023: The camera-ready submission deadline was extended to August 30, 2023. Please check this page later. All authors will also be notified via E-mail when the Author-Kit-Link (prepared by the IEEE CSP) is ready. Note: The camera-ready paper and copyright form should be submitted via the IEEE CSP Author-Kit-Link (not via EDAS).
  • August 11, 2023 :The Author-Kit-Kink for uploading your camera-ready paper will be posted here soon.
  • August 10, 2023: Notification of acceptance and rejection is sent to all authors. Authors who did not receive notification should contact the PC chair.
  • June 30, 2023: The submission deadline is extended: May 30, 2023 –> June 30, 2023 –> July 10, 2023 (HARD DEADLINE – no further extension will be allowed)
  • March 6, 2023: The Call for Papers of the 16th IEEE MCSoC 2023 is released
  • February 10, 2023: the 16th IEEE MCSoC 2023 will be held as a hybrid of onsite and online event. Participants can select either onsite/offline or online registration.
  • January 31, 2023: The website is released

Call for Papers (.pdf)

The 16th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC-2023) aims to provide the world’s premier forum of leading researchers in the Embedded Multicore/Many-core SoCs software, tools, and applications design areas for academia and industries. From the 2018 edition, the conference targets new emerging topics related to embedded AI, ML, and manycore neuro-inspired computing and systems.
Prospective authors are invited to submit their contributions. All contributions should be original, have not been copyrighted, published, submitted, or accepted for publication elsewhere. Submission of a contribution implies that at least one of the authors will have full registration to the symposium upon acceptance of his/her contribution. Through this symposium, the organizers want to develop an interdisciplinary venue to contribute to and discuss the ongoing innovations, applications, and solutions to challenging embedded and general-purpose computing and design problems. We anticipate having attendees from about 40 countries and territories.

The 16th IEEE MCSoC 2023 has two rounds of paper submissions. Prospective authors are invited to submit their contributions during the 1st round (closed) or/and the 2nd round.

Technical Tracks

Embedded Multicore/Manycore SoC Programming
Track Chair:  Stéphane Louise (CEA, LIST, France)

Embedded Multicore/Manycore SoC Design
Track Chair: Cristinel Ababei (Marquette Univ, USA)

Embedded Multicore/Manycore Systems Testing
Track Chair:  Yeong-Kang Lai (National Chung Hsing University, Taiwan)

Embedded Multicore/Manycore SoC Real-Time Systems
Track Chair:  Yi-Chung Chen (Mediatek, USA)

Embedded Multicore/Manycore SoC Applications
Track Chairs:  Farshad Firouzi (Duke Univ., USA), Bahar Farahani (Shahid Beheshti University, Iran)

Embedded Neuromorphic Computing Systems
Track Chair:  Gianvito Urgese (Politecnico Di Torino, Italy)

Machine Learning for Energy-efficient, Manycore Interconnects
Track Chair:  Md. Farhadur Reza (Eastern Illinois University, USA)

Embedded Multicore/Manycore SoC Architectures
Track Chair:  William J. Song (Yonsei Univ, Korea)

Embedded Multicore/Manycore SoC Interconnection Networks
Track Chair:  José L. Abellán (University of Murcia, Spain)

Embedded Manycore SoC Design Automation and Low-power Design
Track Chair: Stefan Holst (Kyushu Institute of Technology, Japan)

Operating Systems Platforms for Real-Time Embedded Applications
Track Chair:  Weichen Liu (Nanyang Technological University, Singapore)

Hardware Acceleration of AI on the Edge
Track Chair:  Po-Tsang Huang (National Chiao Tung University, Taiwan)

Embedded Hardware Security and Trust
Track Chair:  Yue Zheng (Nanyang Technological University, Singapore)

Special Tracks

Embedded, Cyber-Physical, and IoT Systems  
Chair: John Jose (Indian Institute of Technology Guwahati, India), Zhaoyang Han (Nanjing Forestry University, China)

Embedded Neuroprosthesis, Technologies, and Devices
Chair: Chun-Ming Huang(TSRI, Taiwan) 

Ubiquitous Networking  and Immerging Applications
Chair: TBC

Embedded, Applications and Ubiquitous Computing
Chair: Huang-Chen Lee (National Chung-Cheng Univ., Taiwan), Chun Shan (Guangdong Polytechnic Normal University, China), Lingjun Zhao (Guangdong Polytechnic Normal University, China)

Embedded Machine Learning and Data Analytics
Chair: Kasem Khalil (University of Mississippi, USA), Qinglin Yang (Sun Yat-sen University, China)

Special Sessions

Performance Optimization and Auto-Tuning of Software on Multicore/Manycore Systems (POAT2023)
Chair:  Daichi Mukunoki (RIKEN, Japan)

Machine Learning and Neuromorphic Computing for Edge and IoT 
Chairs:  Khanh Dang (UoA), Anh Vu Doan (Infineon, Germany ) 

Emerging ML and Deep Learning Models: Theory and Applications   
Chair:  Jungpil SHIN (Univ. of Aizu, Japan)

Distributed Computing & Comm. Techniques for Emerging AI Applications
Chair:  Peng Li (Univ. of Aizu, Japan)

Low-power and Solutions for Future SoC Design
Chair:  Hayate Okuhara (National University of Singapore, Singapore) 

Special Session on Parallel/Distributed, Grid, and Cloud Computing
Chairs: Huakun Huang (Guangzhou Univ., China), Zhishang Wang (Univ. of Aizu)

Proceedings Publication and Indexing

The conference proceedings, including all technical tracks, special tracks, and special sessions and workshop papers, will be published by IEEE Conference Proceedings, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore, subject to meeting IEEE Xplore’s scope and quality requirements.
All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, ISI Thomson’s Scientific and Tech. Pro. Scopus, ISTP/ISI Proceedings.

Submission System

Submit your paper online via EDAS:

Please read the submission instructions.

1st Round Key Dates

  • Full Paper Submission:June 30, 2023 –> July 10, 2023
  • Acceptance Notification: August 10, 2023
  • Camera-ready Paper: August 30, 2023

2nd Round Key Dates

  • Full Paper Submission:  September 30, 2023
  • Acceptance Notification: Nov. 2, 2023
  • Camera-ready Paper: Nov. 12, 2023