***Season’s Greetings & Best Wishes for the New Year***
Best Papers Awards
- Title: Energy Saving in a Multi-Context Coarse-Grained Reconfigurable Array with Non-Volatile Flip-Flops
Authors: Aika Kamei (Keio University, Japan), Takuya Kojima (Keio University, Japan), Hideharu Amano (Keio University, Japan), Daiki Yokoyama (Shibaura Institute of Technology, Japan), Hisato Miyauchi (Shibaura Institute of Technology, Japan), Kimiyoshi Usami (Shibaura Institute of Technology, Japan), Keizo Hiraga (Sony Semiconductor Solutions Corp., Japan), Kenta Suzuki (Sony Semiconductor Solutions Corp., Japan), Kazuhiro Bessho (Sony Semiconductor Solutions Corp., Japan) - Title: Host Bypassing: Direct Data Piping from the Network to the Hardware Accelerator
Authors: Ralf Kundel (Technical University of Darmstadt, Germany), Kadir Eryigit (Zoi TechCon GmbH, Germany), Jonas Markussen (Dolphin Interconnect Solutions AS, Norway), Carsten Griwodz (University of Oslo, Norway), Osama Abboud (Huawei Technologies, Germany), Rhaban Hark (Technical University of Darmstadt, Germany), Ralf Steinmetz (Technical University of Darmstadt, Germany)
Best Paper Runner-up Award
- Title: Efficient Resource Shared RISC-V Multicore Processor
Authors: Md Ashraful Islam (Tokyo Institute of Technology, Japan), Kenji Kise (Tokyo Institute of Technology, Japan)
Keynote Speakers’ Slides, Authors’ Presentation Slides & Videos
The Keynote Speakers Slides & Authors’ presentation slides and videos are now available and open to the worldwide scientific communities. You can access them from here.
Announcements
- December 10th, 2021: The procedure for onsite attendees at SUTD, Singapore is posted here. Please follow the instructions as the host venue requires all attendees to obey these regulations strictly.
- December 1st, 2021: The conference final program is online.
- December 1st, 2021: Information about the Zoom and WebPub proceedings (link & password) will be emailed to all registered participants a few days before the start of the conference. We will also post info here. So, pelase check this site later.
- November 16, 2021: Guidelines about <Preparing and Uploading Your Video Presentation> (click here) is released. Please prepare and upload your presentation (slide and video) by November 30, 2021==> December 10, 2021. If you need more information, please contact Prof. Khanh Dang (contact).
- November 11, 2021: The conference Slack workspace is online (click here). If you have not received an invitation email, please contact Prof. Khanh Dang (contact).
- October 10, 2021: The preliminary program (click here) is released. Please confirm your name, affiliation, and paper’s title. If you find a mistake, please contact Prof. Khanh Dang (contact). The final version of the program will be released on December 1st, 2021.
- September 21, 2021: The preliminary program and information about online (Zoom) & onsite presentations will be posted here by October 10, 2021.
- September 06, 2021: The Author-Kit page is ready. Please upload your camera-ready paper by September 15, 2021, according to the given instructions. Author Registration Deadline: September 15, 2021.===> JUMP TO THE REGISTRATION PAGE
- September 6, 2021: Singapore Immigration & Checkpoints Authority – Latest Border Measures
- July 5, 2021: MCSoC 2021 will be held as a hybrid of onsite and online events. Participants can select either onsite/offline or online registration.
- June 26, 2021: The submission deadline is extended to
June 25, 2021–> July 30, 2021 (HARD deadline – no further extension will be allowed)
Program Highlights
- Three Distinguished Invited Speakers from industry & academia with innovative ideas will speak at the event
- A four-day technical program featuring oral and poster presentations
- Special Sessions on selected emerging topics in Embedded Multicore SoCs technology
- Regular and special sessions on algorithms, architecture, and hardware acceleration for ML and AI on the edge
- Three Best Paper Awards to award authors with superior quality paper submission
The IEEE 14th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC-2021) aims to provide the world’s premier forum of leading researchers in the Embedded Multicore/Many-core SoCs software, tools, and applications design areas for academia and industries. From the 2018 edition, the MCSoC symposium targets new emerging topics related to multicore neuro-inspired computing architectures and systems. Prospective authors are invited to submit their contributions. Submission of a contribution implies that at least one of the authors will have a full registration to the symposium upon acceptance of his/her contribution. Submission can include, technical and experimental, theoretical, conceptual, or a survey.
Technical Tracks
Special Sessions, Workshops
| Auto-Tuning for Multicore and GPU (ATMG2021) Session Chair: Masahiro Nak (RIKEN R-CCS, Japan) | FPGA Technologies for Adaptive Computing (FTAC 2021) Session Chair: Fujieda Naoki (AIT, Japan) |
| Distributed Computing and Communication Techniques for Emerging AI Applications Session Chair: Peng Li (Univ. of Aizu, Japan), | Secure, Reliable, and Energy-efficient Execution on MPSoCs Session Chair: Alok Prakesh (NTU, Singapore), Amit K. Singh (UK) |
| Intelligent Systems and Learning Technologies: Models, Methods, and Applications Session Chair: Mohamed Hamada (Univ. of Aizu, Japan), Sarika Jain (NITKKR, India) | Low-power and Solutions for Future SoC design Session Chair: Akram Ben Ahmed (AIST, Japan), Hayate Okuhara (Italy) |
| Emerging Machine Learning and Deep Learning Models: Theory and Applications Session Chair: Jungpil Shin (Univ. of Aizu, Japan) | Symposium on Neuromorphic Circuits and Systems (NCAS2021) |
Tutorials
- Tutorial 1: Embedded Technologies for Multimodal Glove Development, Prof. Lei Jing, University of Aizu, Japan
Proceedings Publication and Indexing
MCSoC-2021 proceedings will be published by IEEE CS Press, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, and ISI Thomson’s Scientific and Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson.
Submission System
Important dates
- Abstract submission:
June 25, 2021–> July 30, 2021 - Full Paper submission:
June 25, 2021–> July 30, 2021 (HARD deadline – no further extension will be allowed) - Acceptance notification: September 5, 2021
- Camera-ready paper: September 15, 2021
- Symposium date: December 20-23, 2021
Best Paper Award and Journal Special Issues
Three accepted papers will be selected for best paper awards. Selected papers will be recommended to the following Journals for potential fast-track publications.
 |  |
