Latest News & Updates
- November 28, 2024: The final program is released
- Nov. 21, 2024: Invitation for a free half-day visit/tour to the Selangor IC Design Park, Dec. 16, 2024, 8:00 AM to 1:00 PM. If interested, please fill out this FORM by November 25, 2024. (Note: Only 20 seats are available!)
- November 5, 2024: The 17th IEEE MCSoC 2024 preliminary program is released.
- November 4, 2024: The Author Presentation Guidelines page is updated.
- October 1, 2024: The MCSOC conference will email the authors/speakers/general-attendees who select the ONLINE option all the needed information ( Zoom Link, WebPub access information, and passwords) by December 10, 2024.
- September 27, 2024: The 17th IEEE MCSoC will feature five distinguished keynote speakers, one plenary speaker, and two workshops from industry and academia. These experts will share their insights, providing invaluable perspectives for all attendees. We encourage you to register soon and take part in this exciting opportunity to learn from leading experts in the field.
- January 1st, 2024: The 17th IEEE MCSoC 2024 will be a hybrid event in person at the venue or online.
Call for Papers (.pdf)
The IEEE MCSoC (Multicore and Many-core Systems-on-Chip) Forum is very well-known within the field of embedded systems. It is recognized as a significant event that brings together researchers, practitioners, industry experts, and government policymakers from around the world to discuss the latest advancements and innovations in embedded systems and ICs design for emerging applications and sustainable development. The forum features distinguished keynote speakers, technical tracks, and special sessions, making it an important gathering for those involved in embedded system design and research.
The upcoming 17th IEEE MCSoc 2024 will take place in Kuala Lumpur, Malaysia, from December 16 to 19, 2024. This event aims to gather leading researchers and industry experts to discuss advancements and challenges in embedded multicore/manycore systems, including topics like embedded AI and machine learning. The event also features numerous technical tracks and special sessions, further enhancing its reputation within the community. The organizers anticipate having attendees from about 40 countries and territories.
Keynote Speakers
Plenary Speakers & Workshops
Proceedings Publication and Indexing
The conference proceedings, including all technical tracks, special tracks, and special sessions and workshop papers, will be published by IEEE Conference Proceedings, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore, subject to meeting IEEE Xplore’s scope and quality requirements.
All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, ISI Thomson’s Scientific and Tech. Pro. Scopus, ISTP/ISI Proceedings.
Paper Submission & Deadlines
The 17th IEEE MCSoC 2024 has two rounds of paper submissions for all tracks and special sessions. Authors can submit their papers via the 1st Round (Closed) or 2nd Round (Open) submissions. Papers from both rounds will be included in the same proceedings and published in the IEEE Xplore.
All contributions should be original and not copyrighted, published, submitted, or accepted for publication elsewhere. Electronic paper submissions should not exceed eight pages (for REGULAR paper) and four pages (for SHORT paper) in double-column IEEE format, including figures and references. Papers should be formatted as close to the final format -double column, single-spaced, and Times or equivalent font of minimum, 10pt size. The acceptable format is PDF only.
1st Round Full Paper Submission (Closed)
- Paper submission:
June 18, 2024 (FINAL) - Acceptance notification:
July 20, 2024 - Camera-ready paper:
July 31 August 20, 2024
2nd Round Full Paper Submission (Open)
- Paper submission:
August 31, 2024–>September 30, 2024–> October 15, 2025 (FIRM Deadline) - Acceptance notification:
October 31, 2024–> Oct. 29, 2024 - Camera-ready paper: November 8, 2024
Paper Submission System
All papers should be submitted online via EDAS using the following link. Please read the submission instructions.
Note:
For the 2nd round submission, when you log in to EDAS, please submit your paper to the single UNIFIED submission track named <All Paper Submissions to all Tracks & Special Sessions (2nd Round Submission)>
If the paper is accepted, the paper will be moved to the appropriate track and included in the final program.
Special Issues
Authors of selected papers will be invited to submit extended versions of their papers for publication as full journal papers to one of the following journals:
- Special Issue: ”Advances in Heterogeneous Integration for Neuromorphic Computing”, IEEE Transactions on Components, Packaging and Manufacturing Technology.
- Special Issue of Advances in SoCs and Embedded Systems, Electronics
- Electronics and Signal Processing
- Special Issue on Emerging Low-carbon Solutions for Sustainable Smart Buildings and Cities, Frontiers in Sustainable Cities