Empowering Next-Generation Systems with Embedded AI, Microelectronics & SoCs.
Announcements
- April 27, 2025: The paper submission deadline for all tracks and special sessions has been extended to May 31, 2025 (AoE)
- April 27, 2025: We are pleased to announce that Prof. Kiat Seng Yeo, Prof. Massimo Alioto, Prof. Hideharu Amano, COE Yong Kai Ping, and Prof. Won Woo Ro will be delivering keynote speeches at the 18th IEEE MCSoC 2025, where they will share their invaluable academic insights and industrial expertise.
- April 1st, 2025: We are excited to announce that Dr. Muhammad Asif Khan and Prof. Ihor Lubashevsky will deliver esteemed talks at the 18th IEEE MCSoC 2025
- Janaury 1st, 2025: Although the IEEE MCSoC Symposium has returned to its normal in-person format, presenters who cannot attend in person will still have the option to deliver their talks online.
Important Dates
May 31, 2025 (AoE)
Paper Submission Deadline – Extended
July 20, 2025
Author Acceptance Notification
July 31, 2025
Final Manuscript Submission & Author Registration
Keynote Speakers

Kiat Seng Yeo
Singapore University of Technology and Design (SUTD), Singapore

Hideharu Amano
University of Tokyo,
Japan

Massimo Alioto
ECE – National University of Singapore, Singapore

Won Woo Ro
School of Electrical and Electronic Engineering, Yonsei University, South Korea

Yong Kai Ping
Selangor Information Technology & Digital Economy Corporation (Sidec), Malaysia
Plenary Speakers

Ihor Lubashevsky
HSE Tikhonov Moscow Institute of Electronics and Mathematics, Moscow, Russia

Muhammad Asif Khan
Qatar Mobility Innovations Center, Qatar University, Qatar

Jason K. Eshraghian
Department of Electrical and Computer Engineering, University of California, Santa Cruz, U.S.A
Call for Papers (cfp.pdf)
Technical Tracks
- Embedded Multicore/Manycore SoC Programming Chair: Trong-Thuc Hoang, UEC, Japan
- Embedded Multicore/Manycore SoC Architectures Chair: Man Wu, Keio University, Japan
- Embedded Multicore/Manycore SoC Design Chair: Cristinel Ababei, Marquette Univ, U.S.A
- Embedded Multicore/Manycore SoC Interconnection Networks Chair: Baris Taskin, Drexel University, U.S.A.
- Embedded Multicore/Manycore Systems Testing, Security, and Trust Chair: Zheng Yue, The Chinese Univ. of Hong Kong, Shenzhen, China
- Embedded Manycore SoC Design Automation and Low-power Design Chair: Stefan Holst, Kyushu Institute of Technology, Japan
- Embedded Multicore/Manycore SoC Real-Time Systems Chair: Yi-Chung Chen, Mediatek, U.S.A.
- Operating Systems Platforms for Real-Time Embedded Applications Chair: Lei Yang, George Mason University, U.S.A
- Embedded Multicore/Manycore SoC Applications Chair: Chai-Chi Tsai, National Cheng Kung University, Taiwan
- Embedded Hardware Acceleration of AI on the Edge Chairs: Shaswot Shresthamali (Kyushu University, Japan), Po-Tsang Huang (National Yang Ming Chiao Tung University, Taiwan)
- Machine Learning for Energy-efficient, High-Performance, and Reliable Manycore Systems and Interconnects Chairs: Md. Farhadur Reza (Eastern Illinois University, USA), Hanzhi Ma, Zhejiang University, China
- Chiplet-based Multicore Architecture and Design Chairs: Jason Eshraghian ( UC Santa Cruz, USA ), Darshika G. Perera (University of Colorado, USA)
Special Sessions
- Special Session on Performance Optimization and Auto-Tuning of Software on Multicore/Manycore Systems Chair: Tetsuya Hoshino, Nagoya University, Japan
- Special Session on Emerging ML and Deep Learning Models: Theory and Applications Chair: Jungpil Shin, The University of Aizu, Japan
- Special Session on Cutting-Edge Developments in Emerging Applications Chair: Chiang Liang Kok, University of Newcastle, Australia
- Embedded Neuromorphic Computing Systems Chair: Khanh Dang, The University of Aizu, Japan
- Special Session on Embedded Applications and Ubiquitous Computing Chair: Taihai Chen, Zhejiang University, China
- Special Session on Embedded ML and Data Analytics Chairs: Kasem Khalil (Univ. of Mississippi, USA), Qinglin Yang (Sun Yat-sen University, China)
- Special Session on Embedded, Cyber-Physical, and IoT Systems Chair: Bahar Farahani, Shahid Beheshti University, Iran
- Special Session on Embedded Biomedical Engineering Chair: Xin Zhu (Institute of Science, Tokyo, Japan), Md Chowdhury (Qatar University, Qatar)
- Special Session on ML and Neuromorphic Computing for Edge and IoT Chairs: Anh Vu Doan, Infineon, Germany
- Parallel/Distributed, Grid, and Cloud Computing Chairs: Lingjun Zhao (Guangdong Polytechnic Normal University, China), Zhishang Wang (The University of Aizu, Japan)
- Special Session on Intelligent Mechatronics & Neuroprosthesis Technologies Chair: Chun-Ming Huang, Taiwan Semiconductor Research Institute, Taiwan
- Special Session on Distributed Computing & Communication Techniques for Emerging AI Applications Chair: Haoli Zhao, Hebei University of Technology, China
- Special Session on Quantum Technology and Machine Learning Chair: Deepika Saxena, The University of Aizu, Japan
- Advances in Intelligent Systems and Learning Technologies Chair: Mohamed Hamada, The Univ. of Aizu, Japan
- Optical Communications, Devices and Networking Chair: Guo-Wei Lu, Kyushu University, Japan
- Special Session on Emerging Technologies and Sustainability Chairs: TBC
- Advancing Digital Accessibility through AI and ML for Multicore and Embedded Systems Chairs: Vishnu Ramineni(Albertsons Companies, USA), Balaji Shesharao Ingole (Gainwell Technologies llc, USA)
- Special Session on Harnessing AI Tools for Transforming Education Chairs: John Blake (The University of Aizu, Japan), Christina SH NG (ULearning Technology, China)
Paper Submission and Deadlines
Full Paper Submission
- Paper submission:
April 30, 2025, May 31, 2025 (AoE) - Acceptance notification: July 20, 2025
- Final/Camera-ready paper & Author Registration: July 31, 2025
- Conference: Dec. 15-18, 2025
Paper Submission System
All papers should be submitted online via EDAS using the following link. Please read the submission instructions.
All contributions should be original and not copyrighted, published, submitted, or accepted for publication elsewhere. Electronic paper submissions should not exceed eight pages (for REGULAR paper) and four pages (for SHORT paper) in double-column IEEE format, including figures and references. Papers should be formatted as closely as possible to the final format, which includes double columns, single spacing, and a Times or equivalent font in a minimum 10pt size. The acceptable format is PDF only. Each extra page costs 50 US$.
Proceedings Publication and Indexing
The conference proceedings, encompassing all technical tracks, special tracks, special sessions, and workshop papers, will be published by IEEE Conference Proceedings and will be included in the IEEE Computer Society Digital Library (CSDL) and IEEE Xplore, subject to meeting IEEE Xplore’s scope and quality requirements. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, ISI Thomson’s Scientific, and Tech. Pro. Scopus, ISTP/ISI Proceedings.
Exhibit @ MCSoC 2025 – Showcase Your Breakthroughs!
The IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip aims to provide the world’s premier forum of leading researchers in the Embedded Multicore/Many-core SoCs software, tools, and applications design areas for academia and industries. Through this prestigious event, the organizers aim to create an interdisciplinary venue for contributing to and discussing ongoing innovations, applications, and solutions to challenging problems in embedded and general-purpose computing and design.
For the 2024 edition, we anticipate having attendees from 30+ countries and territories.
Exhibiting @ MCSOC provides visibility and credibility to your company. It enables you to generate new leads, attract new customers, and ultimately establish a more established and renowned brand. MCSOC offers numerous opportunities to showcase your company and products, including exhibits, special promotional events, customer meetings, and social functions.
Sponsors, Technical Sponsors, Patrons, and Host











