Empowering Next-Generation Systems with Embedded AI, Microelectronics & SoCs.

Announcements

• 21/6/2025: The first round of paper submissions is now CLOSED, and the review process is currently in progress. The deadline for the second round paper submission will be announced, and the submission site will be OPEN on August 1st, 2025.
• 1/1/2025: Although the IEEE MCSoC Symposium has returned to its normal in-person format, presenters who cannot attend in person will still be able to deliver their talks online.

1st Round Important Dates

Call for Papers (CFP.pdf)

The IEEE MCSoC Forum is a premier global event that unites researchers, practitioners, and industry leaders to explore cutting-edge advancements in embedded systems and integrated circuit (IC) design. With a focus on emerging applications and sustainable development, it serves as a crucial platform for innovation and collaboration. The forum features distinguished keynote speakers, technical tracks, and special sessions, making it an essential gathering for those involved in embedded system design and research. The event is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) and the IEEE Computer Society Technical Community on Microprocessors and Microcomputers (TCMM). For the 2025 edition, we anticipate having attendees from 30+ countries and territories.

Technical Tracks

• Embedded Multicore/Manycore SoC Programming Chair:  Trong-Thuc Hoang, UEC, Japan
• Embedded Multicore/Manycore SoC Architectures Chair: Man Wu, Keio University, Japan
• Embedded Multicore/Manycore SoC Design Chair: Cristinel Ababei, Marquette Univ, U.S.A
• Embedded Multicore/Manycore SoC Interconnection Networks Chair: Baris Taskin, Drexel University, U.S.A.
• Embedded Multicore/Manycore Systems Testing, Security, and Trust Chair:  Zheng Yue, The Chinese Univ. of Hong Kong, Shenzhen, China
• Embedded Manycore SoC Design Automation and Low-power Design Chair: Stefan Holst, Kyushu Institute of Technology, Japan
• Embedded Multicore/Manycore SoC Real-Time Systems Chair: Yi-Chung Chen, Mediatek, U.S.A.
• Operating Systems Platforms for Real-Time Embedded Applications Chair: Lei Yang, George Mason University, U.S.A
• Embedded Multicore/Manycore SoC Applications Chair:  Chai-Chi Tsai, National Cheng Kung University, Taiwan
• Embedded Hardware Acceleration of AI on the Edge Chairs:  Shaswot Shresthamali (Kyushu University, Japan),  Po-Tsang Huang (National Yang Ming Chiao Tung University, Taiwan)
• Machine Learning for Energy-efficient, High-Performance, and Reliable Manycore Systems and Interconnects  Chairs:  Md. Farhadur Reza (Eastern Illinois University, USA), Hanzhi Ma, Zhejiang University, China
• Chiplet-based Multicore Architecture and Design Chairs: Jason Eshraghian ( UC Santa Cruz, USA ), Darshika G. Perera (University of Colorado, USA)

Special Sessions

• Special Session on Performance Optimization and Auto-Tuning of Software on Multicore/Manycore Systems Chair:  Tetsuya Hoshino, Nagoya University, Japan
• Special Session on Emerging ML and Deep Learning Models: Theory and Applications Chair:  Jungpil Shin, The University of Aizu, Japan
• Special Session on Cutting-Edge Developments in Emerging Applications Chair: Chiang Liang Kok, University of Newcastle, Australia
• Embedded Neuromorphic Computing Systems Chair:  Khanh Dang, The University of Aizu, Japan
• Special Session on Embedded Applications and Ubiquitous Computing Chair: Taihai Chen, Zhejiang University, China
• Special Session on Embedded ML and Data Analytics Chairs: Kasem Khalil (Univ. of Mississippi, USA), Qinglin Yang (Sun Yat-sen University, China)
• Special Session on Embedded, Cyber-Physical, and IoT Systems Chair: Bahar Farahani, Shahid Beheshti University, Iran
• Special Session on Embedded Biomedical Engineering Chair: Xin Zhu (Institute of Science, Tokyo, Japan), Md Chowdhury (Qatar University, Qatar)
• Special Session on ML and Neuromorphic Computing for Edge and IoT  Chairs:  Anh Vu Doan, Infineon, Germany 
• Parallel/Distributed, Grid, and Cloud Computing Chairs: Lingjun Zhao (Guangdong Polytechnic Normal University, China), Zhishang Wang (The University of Aizu, Japan)
• Special Session on Intelligent Mechatronics & Neuroprosthesis Technologies Chair: Chun-Ming Huang, Taiwan Semiconductor Research Institute, Taiwan
• Special Session on Distributed Computing & Communication Techniques for Emerging AI Applications Chair:  Haoli Zhao, Hebei University of Technology, China
• Special Session on Quantum Technology and Machine Learning Chair: Deepika Saxena, The University of Aizu, Japan
• Advances in Intelligent Systems and Learning Technologies Chair: Mohamed Hamada, The Univ. of Aizu, Japan
• Optical Communications, Devices and Networking Chair: Guo-Wei Lu, Kyushu University, Japan
• Special Session on Emerging Technologies and Sustainability Chairs: TBC
• Advancing Digital Accessibility through AI and ML for Multicore and Embedded Systems Chairs: Vishnu Ramineni(Albertsons Companies, USA), Balaji Shesharao Ingole (Gainwell Technologies llc, USA)
• Special Session on Harnessing AI Tools for Transforming Education Chairs: John Blake (The University of Aizu, Japan), Christina SH NG (ULearning Technology, China)

Keynote Speakers

Distinguished Speakers

Paper Submission Guidelines

All contributions should be original and not copyrighted, published, submitted, or accepted for publication elsewhere. Electronic paper submissions should not exceed eight pages (for REGULAR paper), four pages (for SHORT paper), and 1 page (for PRESENTATION-ONLY paper) in double-column IEEE format, including figures and references. Papers should be formatted as closely as possible to the final format, which includes double columns, single spacing, and a Times or equivalent font in a minimum 10pt size. The acceptable format is PDF only. Each extra page costs 50 US$. Please read the submission instructions.

Proceedings Publication and Indexing

Sponsors, Technical Sponsors, Patrons, and Host