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News & Updates:

• January 13, 2025: The conference website is released.

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The IEEE MCSoC (Multicore and Many-core Systems-on-Chip) Forum is very well-known within the field of embedded systems. It is recognized as a significant event that brings together researchers, practitioners, industry experts, and government policymakers from around the world to discuss the latest advancements and innovations in embedded systems and ICs design for emerging applications and sustainable development. The forum features distinguished keynote speakers, technical tracks, and special sessions, making it an important gathering for those involved in embedded system design and research. The upcoming 18th IEEE MCSoc 2025 will take place in Singapore, Dec. 15-18, 2025. This event aims to gather leading researchers and industry experts to discuss advancements and challenges in embedded multicore/manycore systems, including topics like embedded AI and machine learning​. The event also features numerous technical tracks and special sessions, further enhancing its reputation within the community​. We anticipate having attendees from about 40 countries and territories. The 18th IEEE MCSoC 2025 will be a hybrid event in person at the venue or online. Submission of a contribution implies that at least one of the authors will have full registration to the symposium upon acceptance of his/her contribution. Through this symposium, the organizers want to develop an interdisciplinary venue to contribute to and discuss the ongoing innovations, applications, and solutions to challenging embedded and general-purpose computing and design problems.

Technical Tracks (TBC)

Embedded Multicore/Manycore SoC Programming Chair:  Trong-Thuc Hoang, UEC, Japan	Embedded Multicore/Manycore SoC Architectures Chair: Yeong-Kang Lai, National Chung Hsing University, Taiwan
Embedded Multicore/Manycore SoC Design Chair: Cristinel Ababei, Marquette Univ, U.S.A	Embedded Multicore/Manycore SoC Interconnection Networks Chair:  José L. Abellán (University of Murcia, Spain)
Embedded Multicore/Manycore Systems Testing, Security and Trust Chair:  Tanja Harbaum, Karlsruhe Inst. of Technology, Germany	Embedded Manycore SoC Design Automation and Low-power Design Chair: Stefan Holst , Kyushu Institute of Technology, Japan
Embedded Multicore/Manycore SoC Real-Time Systems Chair:  Yi-Chung Chen, Mediatek, USA	Operating Systems Platforms for Real-Time Embedded Applications Chair:  Lei Yang, George Mason University, U.S.A
Embedded Multicore/Manycore SoC Applications Chairs:  Farshad Firouzi (Duke Univ., USA), Bahar Farahani (Shahid Beheshti University, Iran)	Embedded Hardware Acceleration of AI on the Edge Chairs:  Shaswot Shresthamali (Keio University, Japan),  Po-Tsang Huang (National Chiao Tung University, Taiwan)
Machine Learning for Energy-efficient, High-Performance, and Reliable Manycore Systems and Interconnects  Chairs:  Md. Farhadur Reza (Eastern Illinois University, USA), Hanzhi Ma, Zhejiang University, China	Chiplet-based Multicore Architecture and Design Chairs: Jason Eshraghian ( UC Santa Cruz, USA ), Darshika G. Perera (University of Colorado, USA)

Special Sessions (TBC)

Special Session on Performance Optimization and Auto-Tuning of Software on Multicore/Manycore Systems (POAT2025) Chair:  Norihisa Fujita, Tsukuba University, Japan	Special Session on Emerging ML and Deep Learning Models: Theory and Applications    Chair:  Jungpil Shin, The University of Aizu, Japan
Special Session on Emerging Technologies and Sustainability Chairs: Chiang Liang Kok (Newcastle Australia Institute of Higher Education, Australia / Singapore), Chee Kit Ho (Cushman & Wakefield, Asia Pacific.)	Embedded Neuromorphic Computing Systems Chair:  Khanh Dang, The University of Aizu, Japan
Special Session on Embedded Applications and Ubiquitous Computing Chair: Rize Jin, Tiangong University, China	Special Session on Embedded ML and Data Analytics Chairs: Kasem Khalil (Univ. of Mississippi, USA), Qinglin Yang (Sun Yat-sen University, China)
Special Session on Embedded, Cyber-Physical, and IoT Systems   Chair: Liang Zhao, Shenyang Aerospace University, China	Special Session on Embedded Biomedical Engineering Chair: Xin Zhu, The University of Aizu, Japan
Special Session on ML and Neuromorphic Computing for Edge and IoT  Chairs:  Anh Vu Doan, Infineon, Germany	Parallel/Distributed, Grid, and Cloud Computing Chairs: Lingjun Zhao (Guangdong Polytechnic Normal University, China), Zhishang Wang (The University of Aizu, Japan)
Special Session on Intelligent Mechatronics & Neuroprosthesis Technologies Chair: Chun-Ming Huang, Taiwan Semiconductor Research Institute, Taiwan	Special Session on Distributed Computing & Communication Techniques for Emerging AI Applications Chair:  Haoli Zhao, Hebei University of Technology, China
Special Session on Quantum Technology and Machine Learning Chair: Deepika Saxena, The University of Aizu, Japan	Special Session on Real-Time Natural Language Processing Chairs:  Mudar Sarem, Manara University, Syria, Xiaoming He, NJUPT, China
Optical Communications, Devices and Networking Chair: Guo-Wei Lu, Kyushu University, Japan	Advances in Intelligent Systems and Learning Technologies Chairs: Mohamed Hamada, Yutaka Watanobe, The Univ. of Aizu, Japan

Proceedings Publication and Indexing

Special Issues

Authors of selected papers will be invited to submit extended versions of their papers for publication as full journal papers to one of the following journals:

• Special Issue: ”Advances in Heterogeneous Integration for Neuromorphic Computing”, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Paper Submission & Deadlines

All contributions should be original and not copyrighted, published, submitted, or accepted for publication elsewhere. Electronic paper submissions should not exceed eight pages (for REGULAR paper) and four pages (for SHORT paper) in double-column IEEE format, including figures and references. Papers should be formatted as close to the final format -double column, single-spaced, and Times or equivalent font of minimum, 10pt size. The acceptable format is PDF only. Each extra page costs 50US$.