Chairs
Jason Eshraghian, UC Sata Cruz, USA
Darshika G. Perera, University of Colorado, USA
The semiconductor industry has entered a new era of processor design, moving from monolithic processors to multi/many-core, which can be integrated on a single chip or in an emerging chipset-based system through advanced package technology and standardized interfaces. This kind of architecture promises higher flexibility and time-to-market advantage while maintaining cost-effectiveness. This is a huge shift in client devices server processors, and many other emerging applications. The topics of interest of the track include, but are not limited to:
- Chiplet-based Architectures
- Chiplet-based Design for Multicore Processors
- Multi-chiplet packages
- Innovation process, packaging, and architecture
- Embedded Multi-die Interconnect Bridge
- New techniques for integration of third-party IP
- 3D Interconnects
- New type of foundry for chiplets
- Chiplet Standards
- Advanced Process Technologies
- FPGA-based, High-Level Synthesis Design
- Emerging monolithic 3D logic and memory devices
- Advanced packaging for 2.5D and 3D integration
- Logic design and partition for a 3D system
- 3D memory design and architectures
- Thermal cooling and management Techniques
- Architectural innovations for energy-efficient 3D HI
- EDA tools for 3D integration
