Chair
Stefan Holst (Kyutech, Japan)
The design complexity of many core systems on chips (MCSoCs) has increased over the years following the increase in process technology depth. With performance, power, and thermals being the major concerns in MCSoCs, several automation techniques are employed to simplify the design of such complex MCSoCs and alleviate design errors in power management specifications. The topics of interest of the track include, but are not limited to:
- Design Automation of VLSI
- Low-power VLSI Design,
- VLSI Packaging Technology
- Design Automation of VLSI
- Low-power VLSI Design,
- Layout Algorithms
- Vertical Interconnections in 3D Electronics
- Periphery Interconnection between Stacked ICs
- Area Interconnection between Stacked ICs
- Thermal Management Schemes
