Chair
Yeong-Kang Lai (NCHU, Taiwan)
As the demand and sophistication level of applications in consumer electronics has grown over the years, so has the complexity of multicore systems on chip (MCSoCs) required to drive them. These MCSoCs are expected to meet performance and low-power requirements, especially for emerging technologies. As a result, appropriate test solutions are required to address fault models and failure mechanisms from manufacturing defects and to provide quality and reliability measures.
The topics of interest of the track include, but are not limited to:
- Testing Techniques (delay fault modeling and diagnosis; testing for analog and mixed circuits; online testing; BIST)
- Design For Testability in IC Design (FPGA, SoC, NoC, ASIC)
- Fault Diagnosis and Failure Analysis
- Test and Reliability of ML Systems
- Automatic test pattern generation
- Test synthesis
- Fault simulation
- SiP, 2.5D, and 3D IC Test
- Design for testability and scan test
- Boundary-scan testing
- Memory testing
- Testability measurements
- Memory Test, Diagnosis, and Repair
- Safety and Test for Automotive ICs
