3D Integrated and Heterogeneous Neuromorphic

← Back to the NeuroCore 2026 Page

Track Chair

---

Xabier Iturbe
IK4-Ikerlan Research Alliance, Spain

Call for Papers

Neuromorphic computing is rapidly advancing toward architectures that demand unprecedented levels of integration density, interconnect bandwidth, and functional diversity. This track focuses on emerging technologies that enable scalable, high‑performance neuromorphic systems through 3D integration, chiplet‑based design, and heterogeneous integration of analog, digital, and novel device technologies. The track welcomes contributions that explore new materials, fabrication techniques, packaging strategies, and system‑level architectures that push the boundaries of how neuromorphic intelligence can be physically realized. Submissions may address device‑level innovations, circuit and architecture co‑design, integration methodologies, or full‑system demonstrations.

Topics of Interest include, but are not limited to:

• 3D Integration for Neuromorphic Systems
  • 3D stacking of compute, memory, and sensor layers
  • Through‑silicon vias (TSVs), hybrid bonding, and wafer‑level integration
  • Thermal management and reliability in vertically integrated neuromorphic chips
• Chiplet‑Based Neuromorphic Architectures
  • Interposer‑based and advanced packaging solutions
  • High‑bandwidth, low‑latency interconnects for neuromorphic chiplet ecosystems
  • Modular and scalable neuromorphic system design using chiplets
• Heterogeneous Integration of Mixed‑Signal and Emerging Devices
  • Co‑integration of analog, digital, and mixed‑signal neuromorphic circuits
  • Integration of emerging devices (RRAM, PCM, FeFETs, spintronics, photonics, etc.)
  • Hybrid CMOS–non‑CMOS neuromorphic platforms
• System‑Level Design and Co‑Optimization
  • Architecture–technology co‑design for 3D and heterogeneous neuromorphic systems
  • Communication fabrics, routing strategies, and memory hierarchies
  • Power, performance, and area optimization for integrated neuromorphic platforms
• Fabrication, Packaging, and Test
  • Advanced packaging for neuromorphic accelerators
  • Wafer‑scale integration and large‑area neuromorphic systems
  • Testing, characterization, and benchmarking of 3D/heterogeneous neuromorphic hardware
• Applications and Demonstrations
  • End‑to‑end neuromorphic systems leveraging 3D or heterogeneous integration
  • Real‑world workloads: robotics, edge AI, sensory processing, autonomous systems
  • Benchmarks, datasets, and evaluation methodologies

PATRON, HOST, and SPONSORS