{"id":297,"date":"2022-01-25T17:49:52","date_gmt":"2022-01-25T17:49:52","guid":{"rendered":"https:\/\/mcsoc-forum.org\/site\/?page_id=297"},"modified":"2026-01-29T07:53:28","modified_gmt":"2026-01-29T07:53:28","slug":"track-chiplet","status":"publish","type":"page","link":"https:\/\/mcsoc-forum.org\/site\/index.php\/track-chiplet\/","title":{"rendered":"Chiplet-Based Architectures and Design for Multicore SoCs"},"content":{"rendered":"\n<div class=\"wp-block-group has-border-color has-medium-gray-border-color has-white-background-color has-background\" style=\"border-width:1px;border-radius:12px;padding-top:30px;padding-right:30px;padding-bottom:30px;padding-left:30px\">\n\n<h2 class=\"wp-block-heading has-text-color\" style=\"color:#00629b;text-transform:uppercase;letter-spacing:1px\">Track Chairs<\/h2>\n<hr class=\"wp-block-separator has-text-color has-black-color has-alpha-channel-opacity has-black-background-color has-background is-style-wide\"\/>\n<div class=\"wp-block-columns\"><div class=\"wp-block-column\"><figure class=\"wp-block-image aligncenter size-full has-custom-border\"><img loading=\"lazy\" decoding=\"async\" width=\"300\" height=\"300\" src=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/01\/headshot-square-300x300-1.jpg\" alt=\"Jason Eshraghian\" class=\"wp-image-5063\" style=\"border-radius:100px; width:150px; height:150px; object-fit:cover;\"\/figure srcset=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/01\/headshot-square-300x300-1.jpg 300w, https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/01\/headshot-square-300x300-1-150x150.jpg 150w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/>\n<p class=\"has-text-align-center has-medium-font-size\"><strong><a href=\"https:\/\/ncg.ucsc.edu\/\" style=\"text-decoration: none; color: #00629B;\">Jason Eshraghian<\/a><\/strong><br><span style=\"font-size: 0.9em; color: #555;\">UC Santa Cruz, USA<\/span><\/p>\n<\/div>\n<div class=\"wp-block-column\"><figure class=\"wp-block-image aligncenter size-full has-custom-border\"><img loading=\"lazy\" decoding=\"async\" width=\"576\" height=\"720\" src=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/01\/Darshik-G.Perera.jpg\" alt=\"Darshika G. Perera\" class=\"wp-image-5064\" style=\"border-radius:100px; width:150px; height:150px; object-fit:cover;\"\/figure srcset=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/01\/Darshik-G.Perera.jpg 576w, https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/01\/Darshik-G.Perera-240x300.jpg 240w, https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/01\/Darshik-G.Perera-480x600.jpg 480w\" sizes=\"auto, (max-width: 576px) 100vw, 576px\" \/>\n<p class=\"has-text-align-center has-medium-font-size\"><strong><a href=\"https:\/\/ece.uccs.edu\/~dperera\/\" style=\"text-decoration: none; color: #00629B;\">Darshika G. Perera<\/a><\/strong><br><span style=\"font-size: 0.9em; color: #555;\">University of Colorado, USA<\/span><\/p>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n<p>The semiconductor industry is undergoing a significant transformation, shifting from traditional monolithic processors to multi-core and many-core architectures. These advanced designs, which can be integrated onto a single chip or within emerging chiplet-based systems, leverage cutting-edge packaging technologies and standardized interfaces. This innovation offers greater flexibility, accelerated time-to-market, and enhanced cost-efficiency, marking a pivotal change in client devices, server processors, and a broad range of emerging applications.<br>As generative AI models grow increasingly complex, with Large Language Model (LLM) parameters reaching billions, the demand for computational power intensifies across the software-hardware ecosystem. Chiplet-based architectures present an exciting solution to address these challenges, providing scalable, energy-efficient, and cost-effective processing capabilities. This advancement has the potential to redefine the future of cognitive systems and unlock new opportunities for AI-driven applications. <br><br>The topics of interest of the track include, but are not limited to:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Chiplet-based architectures and designs for multicore processors.<\/li>\n\n\n\n<li>Multi-chiplet packages and standards.<\/li>\n\n\n\n<li>Advanced packaging for 2.5D\/3D integration.<\/li>\n\n\n\n<li>Embedded Multi-die Interconnect Bridge (EMIB).<\/li>\n\n\n\n<li>3D interconnects and memory design.<\/li>\n\n\n\n<li>Innovation in packaging and integration of third-party IP.<\/li>\n\n\n\n<li>Emerging monolithic 3D logic and memory devices.<\/li>\n\n\n\n<li>Architectural innovations for energy-efficient 3D heterogeneous integration (HI).<\/li>\n\n\n\n<li>Thermal cooling and management techniques.<\/li>\n\n\n\n<li>FPGA-based high-level synthesis design.<\/li>\n\n\n\n<li>EDA tools for 3D system integration.<\/li>\n\n\n\n<li>Advanced process technologies and foundries for chiplets.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">Paper Submission<\/h3>\n\n\n\n<p><br>The paper submission for this session is&nbsp;<mark>OPEN.<\/mark>&nbsp;Please access the&nbsp;<a href=\"https:\/\/mcsoc-forum.org\/site\/index.php\/paper-submission\/\"><strong>submission page<\/strong><\/a>&nbsp;for more information about the submission deadline and instructions.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<p><mark style=\"background-color:rgba(0, 0, 0, 0)\" class=\"has-inline-color has-vivid-purple-color\">PATRON&amp;HOST,  SPONSORS (<strong>TBC<\/strong>), PARTNERS &amp; TS , SISTER CONFERENCES<\/mark><\/p>\n\n\n\n<div class=\"wp-block-group is-nowrap is-layout-flex wp-container-core-group-is-layout-1 wp-block-group-is-layout-flex\">\n<figure class=\"wp-block-image size-large is-resized\"><img decoding=\"async\" src=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2022\/01\/ASL-e1624758839307-3.jpg\" alt=\"\" style=\"width:92px;height:auto\"\/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" src=\"http:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2022\/04\/IEEE-L.png\" alt=\"\"\/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large is-resized\"><img decoding=\"async\" src=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2023\/11\/logo_IEEE_SMC_Singapore-1024x336.png\" alt=\"\" style=\"width:229px;height:auto\"\/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large is-resized\"><img decoding=\"async\" src=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2022\/06\/TCMM.jpg\" alt=\"\" style=\"width:119px;height:auto\"\/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large is-resized\"><img decoding=\"async\" src=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2022\/06\/IEEE-CS_LogoTM-orange-300x92-1.png\" alt=\"\" style=\"width:214px;height:auto\"\/><\/figure>\n\n\n\n<p><\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" src=\"http:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/01\/L-NC.png\" alt=\"\"\/><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-group is-layout-grid wp-container-core-group-is-layout-2 wp-block-group-is-layout-grid\">\n<figure class=\"wp-block-image size-large wp-container-content-1\"><img decoding=\"async\" src=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2022\/01\/Hot-Chips-Logo-300x189-1.jpg\" alt=\"\"\/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" src=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/08\/HOTI-300x149.jpeg\" alt=\"\"\/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" src=\"http:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/05\/LOGO_ESP-L.png\" alt=\"\"\/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large wp-container-content-2\"><img decoding=\"async\" src=\"https:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/10\/sidec1-300x107.jpg\" alt=\"\"\/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" src=\"http:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2022\/04\/StarFive-logo-1024x345.jpg\" alt=\"\"\/><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" src=\"http:\/\/mcsoc-forum.org\/site\/wp-content\/uploads\/2024\/08\/mcsoc-logo-3.gif\" alt=\"\"\/><\/figure>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Track Chairs Jason EshraghianUC Santa Cruz, USA Darshika G. PereraUniversity of Colorado, USA The semiconductor industry is undergoing a significant transformation, shifting from traditional monolithic processors to multi-core and many-core architectures. These advanced designs, which can be integrated onto a single chip or within emerging chiplet-based systems, leverage cutting-edge packaging technologies and standardized interfaces. This &hellip; <\/p>\n<p><a class=\"more-link btn\" href=\"https:\/\/mcsoc-forum.org\/site\/index.php\/track-chiplet\/\">Continue reading<\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-297","page","type-page","status-publish","hentry","nodate","item-wrap"],"_links":{"self":[{"href":"https:\/\/mcsoc-forum.org\/site\/index.php\/wp-json\/wp\/v2\/pages\/297","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mcsoc-forum.org\/site\/index.php\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/mcsoc-forum.org\/site\/index.php\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/mcsoc-forum.org\/site\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/mcsoc-forum.org\/site\/index.php\/wp-json\/wp\/v2\/comments?post=297"}],"version-history":[{"count":43,"href":"https:\/\/mcsoc-forum.org\/site\/index.php\/wp-json\/wp\/v2\/pages\/297\/revisions"}],"predecessor-version":[{"id":11072,"href":"https:\/\/mcsoc-forum.org\/site\/index.php\/wp-json\/wp\/v2\/pages\/297\/revisions\/11072"}],"wp:attachment":[{"href":"https:\/\/mcsoc-forum.org\/site\/index.php\/wp-json\/wp\/v2\/media?parent=297"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}