Track 6 Chairs

  • TBC

Co-Chair

  • TBC

Topics of Interest

The topics of interest of the track include, but are not limited to:

  • 3D VLSI packaging Technology
  • Vertical Interconnections in 3D Electronics
  • Periphery Interconnection between Stacked ICs
  • Area Interconnection between Stacked ICs
  • Thermal management schemes.