Latest News & Updates
- June 20, 2017: Notification of acceptance is extended to June 27, 2017.
- May 1, 2017: Three outstanding invited keynote speakers will speak at the IEEE MCSoC-17
- April 28, 2017: The paper submission deadline is extended to May 20, 2017. (Final Deadline Extension)
- April 17, 2017: Three to four outstanding invited speakers with innovative ideas are planned for the IEEE MCSoC-17.
- April 14, 2017: The paper submission deadline is extended to April 30, 2017.
The 11th IEEE MCSoC-17 (11th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip) aims at providing the world’s premier forum of leading researchers in the embedded Multicore/Many-core SoCs software, tools and applications design areas for Academia and industries. Prospective authors are invited to submit papers of their works. Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon acceptance of the paper.
Program Tracks
- Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
- Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
- Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
- Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
- Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
- Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
- Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
- Benchmarks: Parallel Benchmarks, Workload characterization and evaluation
- Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, and Consumer electronics.
Special Sessions
- Special Session on Auto-Tuning for Multicore and GPU
- Special Session on Data Analytics and Machine Learning on Multicore, GPU, and Big Data Center
Important Dates
- Paper submission: April 15, 2017 –> May 20, 2017 (Final Deadline Extension)
- Acceptance notification: June 23, 2017 –> June 27, 2017 (extended)
- Camera ready paper: July 14, 2017
Proceedings Publication and Indexing
MCSoC-17 proceedings will be published by IEEE Computer Society, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, and ISI Thomson’s Scientific and Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson.
Special Issue
Authors of selected papers from IEEE MCSoC-17 Symposium will be invited to submit extended versions of their papers to the following journal/transaction for inclusion in special issue (TBC).