***Thank You all for making the 11th IEEE MCSoC a great success. See you all next year in Hanoi! ***

Keynote Presentation Slides Downloads

Latest News & Updates

  • September 21, 2017: You can download the conference photos here.
  • September 15, 2017: Proceeding Download Link is here.
  • September 13, 2017: The Registration site  is closed.
  • July 21, 2017: Early Registration Deadline is extended to July 27, 2017
  • July 17, 2017:  Early Registration Deadline is by July 20, 2017
  • July 3, 2017: The Registration site  is open.
  • June 28, 2017:  Author-kit  page is released. Camera-ready paper due date is on July 20, 2017
  • June 20, 2017: Notification of acceptance is extended to June 27, 2017.
  • May 1, 2017: Three outstanding invited keynote speakers will speak at the IEEE MCSoC-17
  • April 28, 2017: The paper submission deadline is extended to May 20, 2017. (Final Deadline Extension)
  • April 17, 2017: Three to four outstanding invited speakers with innovative ideas are planned for the IEEE MCSoC-17.
  • April 14, 2017: The paper submission deadline is extended to April 30, 2017.

Call for Papers

The 11th IEEE MCSoC-17 (11th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip) aims at providing the world’s premier forum of leading researchers in the embedded Multicore/Many-core SoCs software, tools and applications design areas for Academia and industries. Prospective authors are invited to submit papers of their works. Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon acceptance of the paper.

Program Tracks

  1. Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
  2. Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
  3. Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
  4. Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
  5. Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
  6. Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
  7. Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
  8. Benchmarks: Parallel Benchmarks, Workload characterization and evaluation
  9. Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, and Consumer electronics.

Special Sessions

Important Dates

  • Paper submission: April 15, 2017  –> May 20, 2017 (Final Deadline Extension)
  • Acceptance notification: June 23, 2017 –> June 27, 2017 (extended)
  • Camera ready paper: July 14, 2017 –> July 20, 2017 (Extended)

Proceedings Publication and Indexing

MCSoC-17 proceedings will be published by IEEE Computer Society, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore. All CPS conference publications are also submitted for indexing to EI’s Engineering  Information Index, Compendex, and ISI Thomson’s Scientific and Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson.


***Organized by Korea University and BK Plus***