Chairs
Chiang Liang Kok
Newcastle Australia Institute of Higher Education, Australia / Singapore
Chee Kit Ho
Cushman & Wakefield, Asia Pacific.
In an era where technology intersects with sustainability, this special session explores the pivotal role of engineering systems in advancing sustainable practices across various domains. We welcome high-quality research papers that delve into innovative solutions and applications of multicore system-on-chip (SoC) technology to address sustainability challenges in engineering, healthcare, energy, artificial intelligence, service, system, and product design.
Topics of Interest
We seek contributions highlighting sustainability integration into electronic systems, showcasing smart and intelligent solutions enabled by multicore SoCs. Topics of interest include, but are not limited to:
- Sustainable Engineering: Techniques and systems that enhance sustainability in engineering practices, including eco-friendly materials, energy-efficient designs, and sustainable manufacturing processes.
- Healthcare: Innovations in medical electronics that improve patient care, reduce healthcare costs, and promote sustainability in healthcare systems. This includes wearable devices, telemedicine solutions, and AI-driven diagnostics.
- Energy: Advanced electronic systems and technologies that support sustainable energy generation, distribution, and consumption. Topics may include smart grids, renewable energy integration, and energy-efficient electronics.
- Artificial Intelligence: AI-driven solutions that contribute to sustainability, such as intelligent resource management, predictive maintenance, and optimization of multicore SoC performance for energy efficiency.
- Service, System, and Product Design: Approaches and methodologies for designing sustainable services, systems, and products. This includes lifecycle analysis, sustainable product development, and service innovations that reduce environmental impact.
Paper Submission
The paper submission for this session is OPEN. Please access this submission page for more information about the submission deadline and instructions.
