The IEEE MCSoC Forum is a premier global event, uniting researchers, practitioners, and industry leaders to explore cutting-edge advancements in embedded systems and integrated circuit (IC) design. With a focus on emerging applications and sustainable development, it serves as a crucial platform for innovation and collaboration. The forum features distinguished keynote speakers, technical tracks, and special sessions, making it an essential gathering for those involved in embedded system design and research.
The event is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) and the IEEE Computer Society Technical Community on Microprocessors and Microcomputers (TCMM). This renowned IEEE annual event, established by Prof. Abderazek Ben Abdallah in 2004, has been hosted in various countries, including Japan, Austria, France, Italy, South Korea, the United States, China, Singapore, Vietnam, and Malaysia.

Aims & Scope

The IEEE MCSoC (Multicore and Many-core Systems-on-Chip) Forum has earned significant acclaim in the realm of embedded systems since its inception in 2004. This pivotal forum functions as a premier platform where researchers, practitioners, industry experts, and government policymakers come together to engage in meaningful discourse regarding the latest advancements and innovations in embedded systems and integrated circuit (IC) design, with a keen focus on emerging applications and sustainable development initiatives.

The forum features a robust program highlighted by distinguished keynote speakers, comprehensive technical tracks, and specialized sessions. This structure solidifies its status as a vital gathering for professionals involved in embedded system design and research. Key areas of focus include the latest advancements and challenges in embedded multicore and manycore systems, especially on cutting-edge topics such as embedded artificial intelligence (AI) and machine learning. The forum serves not only as a venue for knowledge sharing but also as a catalyst for collaboration and innovation among attendees.

Moreover, the IEEE MCSoC Forum actively fosters an interdisciplinary environment that encourages collaboration among leading researchers and industry authorities to address the complex challenges facing both embedded and general-purpose computing domains. This approach promotes the development of community-driven solutions, facilitating discussions that bridge various fields of study and practice.

The forum has been hosted in numerous countries, including the United States, France, Italy, Austria, Japan, China, and Singapore. This consistent turnout demonstrates the forum’s essential role in shaping the future landscape of embedded systems and its commitment to fostering collaborative efforts to address contemporary challenges within the field. The ongoing success of the IEEE MCSoC Forum underscores its significance as a global hub for knowledge exchange and innovation, thereby solidifying its position at the forefront of advancements in embedded systems engineering.

Topics of Interest

Specific topics of interest include, but are not limited to:

1. Embedded Multicore/Manycore SoC Programming

Parallel Programming Models
Multicore Programming Languages
Performance Optimization Techniques
Debugging and Profiling Tools
Software Development Kits (SDKs) for Multicore Systems

2. Embedded Multicore/Manycore SoC Architectures

Core and Thread Management
Cache Coherence Protocols
On-chip Communication Networks
Power Management Strategies
Heterogeneous Computing Architectures

3. Embedded Multicore/Manycore SoC Design

System-on-Chip (SoC) Design Flow
Hardware/Software Co-Design
Design for Testability (DFT)
Thermal Management
Fault Tolerance and Reliability

4. Embedded Multicore/Manycore SoC Interconnection Networks

Network-on-Chip (NoC) Topologies
Data Transfer Protocols
Quality of Service (QoS) Management
Network Security
Scalability and Performance Metrics

5. Embedded Multicore/Manycore Systems Testing, Security, and Trust

Testing Methodologies for Multicore Systems
Security Threats and Countermeasures
Trust and Integrity Verification
Fault Injection and Testing
Hardware Security Modules (HSMs)

6. Embedded Manycore SoC Design Automation and Low-power Design

Automated Design Tools and Frameworks
Power-Aware Design Techniques
Energy-Efficient Algorithms
Low-Power Verification
Design Space Exploration

7. Embedded Multicore/Manycore SoC Real-Time Systems

Real-Time Operating Systems (RTOS)
Scheduling Algorithms
Timing Analysis and Verification
Real-Time Communication Protocols
Fault-Tolerant Real-Time Systems

8. Operating Systems Platforms for Real-Time Embedded Applications

OS Architecture for Embedded Systems
Resource Management
Real-Time Scheduling and Synchronization
Inter-Process Communication (IPC)
Security and Safety Features

9. Embedded Multicore/Manycore SoC Applications

Automotive and Aerospace Applications
Industrial IoT
Consumer Electronics
Medical Devices
Smart Grids and Energy Management

10. Embedded Hardware Acceleration of AI on the Edge

Edge AI Algorithms and Models
Hardware Accelerators for AI
AI Workload Optimization
Edge Computing Platforms
Real-Time AI Applications

11. Machine Learning for Energy-Efficient Manycore Systems and Interconnects

Machine Learning for System Optimization
Energy-Efficient ML Algorithms
High-Performance Computing (HPC) for ML
Reliability and Fault Tolerance in ML Systems
ML for Network Optimization

12. Chiplet-based Multicore Architecture and Design

Chiplet Integration Techniques
Inter-Chiplet Communication
Thermal and Power Management for Chiplets
Design for Manufacturability (DFM)
Chiplet-based System Design

13. IC/SoC Design

Fundamentals Design: Semiconductor physics and materials; MOSFET operation and characteristics; Digital vs. analog circuits; IC fabrication processes
Types of ICs/SoCs: Digital ICs (Microprocessors, Memory chips, FPGA, ASIC); Analog ICs (Operational amplifiers, RF circuits, Power management ICs); Mixed-signal ICs (ADC, DAC, Sensor interface ICs); System-on-Chip (SoC) and Multi-Chip Modules (MCM);
Design Methodologies: RTL design and synthesis (Verilog, VHDL); Standard cell design; Custom layout design; Full-custom vs. semi-custom design; Design for Manufacturability (DFM); Design for Testability (DFT)
EDA Tools: Simulation tools (SPICE, Cadence, Synopsys, Mentor Graphics); Layout and verification tools; Schematic capture and PCB design tools; Logic synthesis and place-and-route tools
Fabrication & Packaging: Photolithography and wafer processing; CMOS fabrication techniques; IC packaging types (DIP, QFP, BGA); Thermal and power considerations
Advanced Topics: Low-power IC design; High-speed design techniques; RF and microwave IC design; AI and ML hardware accelerators; Neuromorphic computing; Quantum computing ICs
Verification & Testing: Functional verification and emulation; Static timing analysis (STA); Automated test equipment (ATE); Fault modeling and coverage metrics
Emerging Trends: 3D ICs and chiplets; Silicon photonics; RISC-V open-source architecture; Edge computing and IoT IC design;