Call for Papers

CFP.pdf CFP.txt Call for Special Session.pdf

The IEEE MCSoC (Multicore and Many-core Systems-on-Chip) Forum is a premier global symposium sponsored by IEEE and the IEEE Computer Society (TCMM). It unites researchers, practitioners, and industry experts involved in embedded system design, multicore architectures, and IC design for emerging applications.

The 19th IEEE MCSoC 2026 will be held in Shanghai, China, from December 14–17, 2026. Evolving from its origins in parallel and heterogeneous computing, this edition will address critical challenges in multicore systems, focusing strongly on innovations in embedded AI and machine learning.

The robust technical program will feature keynote lectures, special sessions, and 19 specialized tracks. Key topics include heterogeneous architectures, energy-efficient computing, NoC technologies, neuromorphic systems, and chiplet-based integration. Building on a rich legacy of global editions across Asia, Europe, and the Americas, MCSoC 2026 continues to foster interdisciplinary collaboration and drive the future of intelligent multicore systems.

Hybrid Event: The 19th IEEE MCSoC 2026 will be held as a hybrid event, allowing for in-person attendance at the venue or online participation.

Paper Submission & Deadlines

Requirements

  • Regular Paper: Max 8 pages
  • Short Paper: Max 4 pages
  • Double-column IEEE format
  • Format: PDF Only

Important Dates

  • Submission: April 30, 2026
  • Notification: July 20, 2026
  • Camera-Ready: July 31, 2026
  • Event: Dec 14-17, 2026

Submission System

Submit online via EDAS

Submit

View Instructions

Technical Tracks

Special Sessions

Special Session on Performance Optimization and Auto-Tuning (POAT2026)
Focus: Auto-tuning techniques, performance modeling, and code optimization.
Special Session on Emerging ML and Deep Learning Models
Focus: Advanced DL architectures, theoretical foundations, and novel applications.
Special Session on Cutting-Edge Emerging Applications
Focus: Smart cities, Industry 4.0, and next-generation embedded solutions.
Harnessing AI Tools for Transforming Education
Focus: EdTech innovation, AI in classrooms, and personalized learning.
Special Session on Embedded Applications and Ubiquitous Computing
Focus: Pervasive computing, context-aware systems, and mobile applications.
Special Session on Embedded ML and Data Analytics
Focus: Edge analytics, real-time data processing, and lightweight ML models.
Special Session on Embedded, Cyber-Physical, and IoT Systems
Focus: CPS architecture, sensor networks, and secure IoT integration.
Special Session on Embedded Biomedical Engineering
Focus: Wearable devices, health monitoring, and bio-signal processing.
Special Session on Human-Centric AI and Intelligent Systems for Sustainable Industry
Focus: AI & Machine Learning, Deep Learning, Big Data Analytics, IoT & Edge Computing.
Parallel/Distributed, Grid, and Cloud Computing
Focus: Cloud-edge continuum, high-performance computing, and distributed systems.
Special Session on Mechatronics & Neuroprosthesis
Focus: Robotics, human-machine interfaces, and assistive technologies.
Distributed Computing for Emerging AI Applications
Focus: Federated learning, multi-agent systems, and decentralized AI.
Special Session on Quantum Technology and ML
Focus: Quantum algorithms, quantum machine learning, and hybrid computing.
Intelligent Systems and Learning Technologies
Focus: Adaptive learning, educational AI, and smart tutoring systems.
Optical Communications, Devices and Networking
Focus: Optical networks, photonics, and high-speed data transmission.
Special Session on Emerging Tech and Sustainability
Focus: Green computing, energy-efficient design, and eco-friendly technology.

Proceedings Publication and Indexing

Indexed by

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Published in

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The conference proceedings, including all technical tracks, special tracks, special sessions, and workshop papers, will be published by IEEE Conference Proceedings. These will be included in the Computer Society Digital Library (CSDL) and IEEE Xplore, subject to meeting IEEE Xplore’s scope and quality requirements.

All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, ISI Thomson’s Scientific and Tech. Pro. Scopus, and ISTP/ISI Proceedings.

PATRON, HOST, and SPONSORS

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