Call for Papers.pdf
The IEEE MCSoC (Multicore and Many-core Systems-on-Chip) Forum is very well-known within the field of embedded systems. It is recognized as a significant event that brings together researchers, practitioners, industry experts, and government policymakers from around the world to discuss the latest advancements and innovations in embedded systems and IC design for emerging applications and sustainable development. The forum features distinguished keynote speakers, technical tracks, and special sessions, making it an essential gathering for those involved in embedded system design and research. The upcoming 18th IEEE MCSoc 2025 will take place in Singapore from December 15 to 18, 2025. This event aims to gather leading researchers and industry experts to discuss advancements and challenges in embedded multicore and manycore systems, including topics such as embedded AI and machine learning. The event also features numerous technical tracks and special sessions, further enhancing its reputation within the community. We anticipate having attendees from about 40 countries and territories. The 18th IEEE MCSoC 2025 will be a hybrid event, in person at the venue or online. Submission of a contribution implies that at least one of the authors will have full registration to the symposium upon acceptance of his/her contribution. Through this symposium, the organizers aim to create an interdisciplinary venue for contributing to and discussing ongoing innovations, applications, and solutions to challenging problems in embedded and general-purpose computing and design.
Technical Tracks
Embedded Multicore/Manycore SoC Programming Chair: Trong-Thuc Hoang, UEC, Japan | Embedded Multicore/Manycore SoC Architectures Chair: Man Wu, Keio University, Japan |
Embedded Multicore/Manycore SoC Design Chair: Cristinel Ababei, Marquette Univ, U.S.A | Embedded Multicore/Manycore SoC Interconnection Networks Chair: Baris Taskin, Drexel University, U.S.A. |
Embedded Multicore/Manycore Systems Testing, Security and Trust Chair: ZHENG Yue, The Chinese Univ. of Hong Kong, Shenzhen, China | Embedded Manycore SoC Design Automation and Low-power Design Chair: Stefan Holst , Kyushu Institute of Technology, Japan |
Embedded Multicore/Manycore SoC Real-Time Systems Chair: Yi-Chung Chen, Mediatek, USA | Operating Systems Platforms for Real-Time Embedded Applications Chair: Lei Yang, George Mason University, U.S.A |
Embedded Multicore/Manycore SoC Applications Chair: Chai-Chi Tsai, National Cheng Kung University, Taiwan | Embedded Hardware Acceleration of AI on the Edge Chairs: Shaswot Shresthamali (Keio University, Japan), Po-Tsang Huang (National Yang Ming Chiao Tung University, Taiwan) |
Machine Learning for Energy-efficient, High-Performance, and Reliable Manycore Systems and Interconnects Chairs: Md. Farhadur Reza (Eastern Illinois University, USA), Hanzhi Ma, Zhejiang University, China | Chiplet-based Multicore Architecture and Design Chairs: Jason Eshraghian ( UC Santa Cruz, USA ), Darshika G. Perera (University of Colorado, USA) |
Special Sessions
Proceedings Publication and Indexing
The conference proceedings, including all technical tracks, special tracks, special sessions, and workshop papers, will be published by IEEE Conference Proceedings, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore, subject to meeting IEEE Xplore’s scope and quality requirements. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, ISI Thomson’s Scientific and Tech. Pro. Scopus, ISTP/ISI Proceedings.
Special Issues
Authors of selected papers will be invited to submit extended versions of their papers for publication as full journal papers to one of the following journals:
- Special Issue: ”Advances in Heterogeneous Integration for Neuromorphic Computing”, IEEE Transactions on Components, Packaging and Manufacturing Technology.
Paper Submission & Deadlines
All contributions should be original and not copyrighted, published, submitted, or accepted for publication elsewhere. Electronic paper submissions should not exceed eight pages (for REGULAR paper) and four pages (for SHORT paper) in double-column IEEE format, including figures and references. Papers should be formatted as close to the final format -double column, single-spaced, and Times or equivalent font of minimum, 10pt size. The acceptable format is PDF only. Each extra page costs 50US$.
Full Paper Submission
- Paper submission:
April 30, 2025, May 31, 2025 (AoE) - Acceptance notification: July 20, 2025
- Camera-ready paper & Author Registration: July 31, 2025
- Conference: Dec. 15-18, 2025
Paper Submission System
All papers should be submitted online via EDAS using the following link. Please read the submission instructions.