Call for Papers

Call for Papers (.pdf)

The 16th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC-2023) aims to provide the world’s premier forum of leading researchers in the Embedded Multicore/Many-core SoCs software, tools, and applications design areas for academia and industries. From the 2018 edition, the conference targets new emerging topics related to embedded AI, ML, and manycore neuro-inspired computing and systems.
Prospective authors are invited to submit their contributions. All contributions should be original and not published elsewhere or intended to be published during the review period. Submission of a contribution implies that at least one of the authors will have a full registration to the symposium upon acceptance of his/her contribution. Through this symposium, the organizers want to develop an interdisciplinary venue to contribute to and discuss the ongoing innovations, applications, and solutions to challenging embedded and general-purpose computing and design problems. We anticipate having attendees from about 40 countries and territories.
Every submitted paper will be evaluated by at least three reviewers in technical quality, originality, significance to the symposium, and organization. We encouraged authors to proofread and spell-check their papers before submission. The 16th IEEE MCSoC 2023 proceedings will be published by the IEEE Computer Society, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, ISI Thomson’s Scientific and Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson.

Note: MCSoC does not accept abstract-only submissions

To be published in the IEEE MCSoC Symposium Proceedings and to be eligible for publication in IEEE Xplore®, an author of an accepted paper is required to register for the conference at the full (member or non-member) rate and the paper must be presented by an author of that paper at the conference unless the TPC Chair grants permission for a substitute presenter arranged in advance of the event and who is qualified both to present and answer questions.

The 16th IEEE MCSoC 2023 has two rounds of paper submissions. Prospective authors are invited to submit their contributions during the 1st round (closed) or/and the 2nd round.

Technical Tracks

Embedded Multicore/Manycore SoC Programming
Track Chair:  Stéphane Louise (CEA, LIST, France)

Embedded Multicore/Manycore SoC Design
Track Chair: Cristinel Ababei (Marquette Univ, USA)

Embedded Multicore/Manycore SoC Testing
Track Chair:  Yeong-Kang Lai (National Chung Hsing University, Taiwan)

Embedded Multicore/Manycore SoC Real-Time Systems
Track Chair:  Yi-Chung Chen (Mediatek, USA)

Embedded Multicore/Manycore SoC Applications
Track Chairs:  Farshad Firouzi (Duke Univ., USA), Bahar Farahani (Shahid Beheshti University, Iran)

Embedded Neuromorphic Computing Systems
Track Chair:  Gianvito Urgese (Politecnico Di Torino, Italy)

Machine Learning for Energy-efficient, Manycore Interconnects
Track Chair:  Md. Farhadur Reza (Eastern Illinois University, USA)

Embedded Multicore/Manycore SoC Architectures
Track Chair:  William J. Song (Yonsei Univ, Korea)

Embedded Multicore/Manycore SoC Interconnection Networks
Track Chair:  José L. Abellán (University of Murcia, Spain)

Embedded Manycore SoC Design Automation and Low-power Design
Track Chair: Stefan Holst (Kyushu Institute of Technology, Japan)

Operating Systems Platforms for Real-Time Embedded Applications
Track Chair:  Weichen Liu (Nanyang Technological University, Singapore)

Hardware Acceleration of AI on the Edge
Track Chair:  Po-Tsang Huang (National Chiao Tung University, Taiwan)

Embedded Hardware Security and Trust
Track Chair:  Yue Zheng (Nanyang Technological University, Singapore)

Special Tracks

Embedded, Cyber-Physical, and IoT Systems  
Session Chairs: John Jose (Indian Institute of Technology Guwahati, India), Zhaoyang Han (Nanjing Forestry University, China)

Embedded Neuroprosthesis, Technologies, and Devices
Session Chairs: Chun-Ming Huang(TSRI, Taiwan) 

Embedded, Applications and Ubiquitous Computing
Session Chairs: Huang-Chen Lee (National Chung-Cheng Univ., Taiwan), Chun Shan (Guangdong Polytechnic Normal University, China), Lingjun Zhao (Guangdong Polytechnic Normal University, China)

Embedded Machine Learning and Data Analytics
Session Chairs: Kasem Khalil (University of Mississippi, USA) , Qinglin Yang (Sun Yat-sen University, China)

Special Sessions

Performance Optimization and Auto-Tuning of Software on Multicore/Manycore Systems (POAT2023)
Chair:  Daichi Mukunoki (RIKEN, Japan)

Machine Learning and Neuromorphic Computing for Edge and IoT       Chairs:  Khanh Dang (UoA), Anh Vu Doan (Infineon, Germany ) 

Emerging ML and Deep Learning Models: Theory and Applications    Chair:  Jungpil SHIN (Univ. of Aizu, Japan)

Distributed Computing & Comm. Techniques for Emerging AI Applications
Chair:  Peng Li (Univ. of Aizu, Japan)

Low-power and Solutions for Future SoC Design
Chair:  Hayate Okuhara (National University of Singapore, Singapore) 

Special Session on Parallel/Distributed, Grid, and Cloud Computing
Chairs: Huakun Huang (Guangzhou Univ., China)Zhishang Wang (Univ. of Aizu)


2023 International Workshop on Computer Communication and the Cloud (IW3C)

Proceedings Publication and Indexing

The conference proceedings, including all technical tracks, special tracks, and special sessions and workshop papers, will be published by IEEE Conference Proceedings, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore, subject to meeting IEEE Xplore’s scope and quality requirements.
All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, ISI Thomson’s Scientific and Tech. Pro. Scopus, ISTP/ISI Proceedings.

Submission System

Submit your paper online via EDAS:

Please read the submission instructions.

1st Round Key Dates

  • Paper Submission:  June 30, 2023 –> July 10, 2023
  • Acceptance Notification: August 10, 2023
  • Camera-ready Paper: August 30, 2023

2nd Round Key Dates

  • Full Paper Submission: September 30, 2023
  • Acceptance Notification: Nov. 2, 2023
  • Camera-ready Paper: November 12, 2023