Call for Papers.pdf

The IEEE MCSoC (Multicore and Many-core Systems-on-Chip) Forum is very well-known within the field of embedded systems. It is recognized as a significant event that brings together researchers, practitioners, industry experts, and government policymakers from around the world to discuss the latest advancements and innovations in embedded systems and IC design for emerging applications and sustainable development. The forum features distinguished keynote speakers, technical tracks, and special sessions, making it an essential gathering for those involved in embedded system design and research. The upcoming 18th IEEE MCSoc 2025 will take place in Singapore from December 15 to 18, 2025. This event aims to gather leading researchers and industry experts to discuss advancements and challenges in embedded multicore and manycore systems, including topics such as embedded AI and machine learning. The event also features numerous technical tracks and special sessions, further enhancing its reputation within the community. We anticipate having attendees from about 40 countries and territories. The 18th IEEE MCSoC 2025 will be a hybrid event, in person at the venue or online. Submission of a contribution implies that at least one of the authors will have full registration to the symposium upon acceptance of his/her contribution. Through this symposium, the organizers aim to create an interdisciplinary venue for contributing to and discussing ongoing innovations, applications, and solutions to challenging problems in embedded and general-purpose computing and design.

Technical Tracks

Embedded Multicore/Manycore SoC Programming Chair: Trong-Thuc Hoang, UEC, Japan	Embedded Multicore/Manycore SoC Architectures Chair: Man Wu, Keio University, Japan
Embedded Multicore/Manycore SoC Design Chair: *Cristinel Ababe*i, Marquette Univ, U.S.A	Embedded Multicore/Manycore SoC Interconnection Networks Chair: Baris Taskin, Drexel University, U.S.A.
Embedded Multicore/Manycore Systems Testing, Security and Trust Chair: ZHENG Yue, The Chinese Univ. of Hong Kong, Shenzhen, China	Embedded Manycore SoC Design Automation and Low-power Design Chair: *Stefan Holst ,* Kyushu Institute of Technology, Japan
Embedded Multicore/Manycore SoC Real-Time Systems Chair: *Yi-Chung Chen,* Mediatek, USA	Operating Systems Platforms for Real-Time Embedded Applications Chair: *Lei Yang*, George Mason University, U.S.A
Embedded Multicore/Manycore SoC Applications Chair: Chai-Chi Tsai, National Cheng Kung University, Taiwan	Embedded Hardware Acceleration of AI on the Edge Chairs: *Shaswot Shresthamali* (Keio University, Japan), *Po-Tsang Huang* (National Yang Ming Chiao Tung University, Taiwan)
Machine Learning for Energy-efficient, High-Performance, and Reliable Manycore Systems and Interconnects Chairs: *Md. Farhadur Reza* (Eastern Illinois University, USA), Hanzhi Ma, Zhejiang University, China	Chiplet-based Multicore Architecture and Design Chairs: Jason Eshraghian ( UC Santa Cruz, USA ), Darshika G. Perera (University of Colorado, USA)

Special Sessions

Special Session on Performance Optimization and Auto-Tuning of Software on Multicore/Manycore Systems (POAT2025) Chair: Tetsuya Hoshino, Nagoya University, Japan	Special Session on Emerging ML and Deep Learning Models: Theory and Applications Chair: *Jungpil Shin*, The University of Aizu, Japan
Special Session on Cutting-Edge Developments in Emerging Applications Chair: Chiang Liang Kok, University of Newcastle, Australia	Embedded Neuromorphic Computing Systems Chair: Khanh Dang, The University of Aizu, Japan
Special Session on Embedded Applications and Ubiquitous Computing Chair: Taihai Chen, Zhejiang University, China	Special Session on Embedded ML and Data Analytics Chairs: *Kasem Khalil* (Univ. of Mississippi, USA), *Qinglin Yang* (Sun Yat-sen University, China)
Special Session on Embedded, Cyber-Physical, and IoT Systems Chair: Bahar Farahani, Shahid Beheshti University, Iran	Special Session on Embedded Biomedical Engineering Chair: Xin Zhu (Institute of Science Tokyo, Japan), Md Chowdhury (Qatar University, Qatar)
Special Session on ML and Neuromorphic Computing for Edge and IoT Chairs: Anh Vu Doan, Infineon, Germany	Parallel/Distributed, Grid, and Cloud Computing Chairs: Lingjun Zhao (Guangdong Polytechnic Normal University, China), Zhishang Wang (The University of Aizu, Japan)
Special Session on Intelligent Mechatronics & Neuroprosthesis Technologies Chair: *Chun-Ming Huang,* Taiwan Semiconductor Research Institute, Taiwan	Special Session on Distributed Computing & Communication Techniques for Emerging AI Applications Chair: Haoli Zhao, Hebei University of Technology, China
Special Session on Quantum Technology and Machine Learning Chair: Deepika Saxena, The University of Aizu, Japan	Advances in Intelligent Systems and Learning Technologies Chair: Mohamed Hamada, The Univ. of Aizu, Japan
Optical Communications, Devices and Networking Chair: Guo-Wei Lu, Kyushu University, Japan	Special Session on Emerging Technologies and Sustainability Chairs: TBC
Advancing Digital Accessibility through AI and ML for Multicore and Embedded Systems Chairs: Vishnu Ramineni(Albertsons Companies, USA), Balaji Shesharao Ingole (Gainwell Technologies llc, USA)	Special Session on Harnessing AI Tools for Transforming Education Chairs: John Blake (The University of Aizu, Japan), Christina SH NG (ULearning Technology, China)

Proceedings Publication and Indexing

The conference proceedings, including all technical tracks, special tracks, special sessions, and workshop papers, will be published by IEEE Conference Proceedings, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore, subject to meeting IEEE Xplore’s scope and quality requirements. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, ISI Thomson’s Scientific and Tech. Pro. Scopus, ISTP/ISI Proceedings.

Special Issues

Authors of selected papers will be invited to submit extended versions of their papers for publication as full journal papers to one of the following journals:

Special Issue: ”Advances in Heterogeneous Integration for Neuromorphic Computing”, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Paper Submission & Deadlines

All contributions should be original and not copyrighted, published, submitted, or accepted for publication elsewhere. Electronic paper submissions should not exceed eight pages (for REGULAR paper) and four pages (for SHORT paper) in double-column IEEE format, including figures and references. Papers should be formatted as close to the final format -double column, single-spaced, and Times or equivalent font of minimum, 10pt size. The acceptable format is PDF only. Each extra page costs 50US$.