Call for Papers

Call for Papers (.tex ; .pdf)

The 16th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC-2023) aims to provide the world’s premier forum of leading researchers in the embedded multicore/many-core system-on-chip software, tools, and applications design areas for academia and industries. From the 2018 edition, the conference targets new emerging topics related to embedded AI, ML, and manycore neuro-inspired computing and systems. Prospective authors are invited to submit their contributions. All contributions should be original and not published elsewhere or intended to be published during the review period. Submission of a contribution implies that at least one of the authors will have a full registration to the symposium upon acceptance of his/her contribution. Through this symposium, the organizers want to develop an interdisciplinary venue to contribute to and discuss the ongoing innovations, applications, and solutions to challenging embedded and general-purpose computing and design problems. We anticipate having attendees from about 40 countries and territories.

Technical Tracks

Embedded Multicore/Manycore SoC Programming
Chair: Stéphane Louise (CEA, LIST, France)
Embedded Multicore/Manycore SoC Applications
Chair: Pei-Yin Chen (National Cheng Kung University, Taiwan)
Embedded Multicore/Manycore SoC Architectures
Chair: William J. Song (Yonsei Univ, Korea)
Embedded Multicore/Manycore SoC Real-Time Systems
Chair: Yi-Chung Chen (SUNY, USA)
Embedded Multicore/Manycore SoC Design
Chairs: Diana Göhringer (TUD, Germany), Cristinel Ababei (Marquette Univ, USA)
Secure and Fault-Tolerant Embedded Computing
Chair: Chun-Ming Huang (TSRI, Taiwan)
Embedded Multicore/Manycore SoC Interconnection Networks
Chair: José L. Abellán (UCAM, Spain)
Machine Learning for Energy-efficient Manycore Interconnects
Chair: Md Farhadur Reza (Eastern Illinois University, USA)
Embedded Multicore/Manycore SoC Testing
Chair: Yeong-Kang Lai (NCHU, Taiwan)
Embedded Neuromorphic Computing Systems
Chair: Gianvito Urgese (PoliTO, Italy)
Embedded Multicore/Manycore SoC Design Automation and Low-power Design
Chairs: Fakhrul Z. Rokhani (UPM, Malaysia)
Hardware Acceleration for AI on the Edge
Chair: Po-Tsang Huang ( National Yang Ming Chiao Tung University, Taiwan)
Operating Systems Platforms for Real-Time Embedded Applications
Chair: Tsung-Tai Yeh (National Yang Ming Chiao Tung University, Taiwan)

Special Tracks

Embedded, Cyber-Physical, and IoT Systems
Chair: Xuchong Zhang (Jiaotong University, China)
Embedded Applications and Ubiquitous Computing
Chair: Chih-Peng Fan (National Chung Hsing University, Taiwan)
Embedded Neuroprosthetics, Technologies, and Devices
Chairs: Chun-Shu Wei (Nat. Yang Ming Chiao Tung Univ. , Taiwan),
Chul Kim (KAIST, Korea)
Embedded Machine Learning, and Data Analytics
Chair: Yuan Du (Nanjing University, Nanjing, China)

Special Sessions & Workshops

Auto-Tuning for Multicore and GPU (ATMG2022)
Chair: Daichi Mukunoki (RIKEN, Japan)
Emerging Machine Learning and Deep Learning Models: Theory and Applications
Chair: Jungpil Shin (The University of Aizu, Japan)
Distributed Computing and Communication Techniques for Emerging AI Applications
Chair: Peng Li (Univ. of Aizu, Japan)
Low-power and Solutions for Future SoC design
Chairs: Akram Ben Ahmed (AIST, Japan), Hayate Okuhara (NUS, Singapore)
Intelligent Systems and Learning Technologies: Models, Methods, and Applications
Chairs: Mohamed Hamada (Univ. of Aizu, Japan), Sarika Jain (NITKKR, India)
Device, Circuit, Architecture, and CAD tools of Advanced FPGAs
and Their Application to Edge AI Computing

Chairs: Daisuke Suzuki (The Univ. Aizu, Japan), Takahiro Hanyu (Tohoku Univ., Japan)

Proceedings Publication and Indexing

The 16th IEEE MCSoC-2023 proceedings, including all technical tracks, special tracks, and special sessions and workshop papers, will be published by IEEE CS Press, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, and ISI Thomson’s Scientific and Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson.

Submission System  

All papers from the 1st round submission and the 2nd round submission should be submitted online vis our EDAS system using the following submission system:


Important Dates

  • Full Paper Submission:  May 30, 2023
  • Acceptance Notification: August 10, 2023
  • Camera-ready Paper and Registration:  August 20, 2023
  • Conference date: December 18-21, 2023 (Hybrid (onsite and online) Style)

Best Paper Award and Journal Special Issues

Three accepted papers will be selected for best paper awards.   
Selected papers will be recommended to the following Journals for potential fast-track publications: