The IEEE MCSoC (Multicore and Many-core Systems-on-Chip) Forum is a premier global event recognized for bringing together researchers, practitioners, and industry experts. The forum serves as an essential gathering for those involved in embedded system design and IC design for emerging applications and sustainable development.
The upcoming 19th IEEE MCSoC 2026 will take place in Shanghai, China, from December 14 to 17, 2026. This edition aims to address challenges in embedded multicore and manycore systems, specifically focusing on innovations in embedded AI and machine learning.
Hybrid Event: The 19th IEEE MCSoC 2026 will be held as a hybrid event, allowing for in-person attendance at the venue or online participation.
Note: Submission of a contribution implies that at least one of the authors will have full registration to the symposium upon acceptance.
Paper Submission & Deadlines
Requirements
- Regular Paper: Max 8 pages
- Short Paper: Max 4 pages
- Double-column IEEE format
- Format: PDF Only
Important Dates
- Submission: April 30, 2026
- Notification: July 20, 2026
- Camera-Ready: July 31, 2026
- Event: Dec 14-17, 2026
Technical Tracks
- Programming Techniques for Embedded Multicore/Manycore SoCs
Focus: Parallel programming models, compiler support, and software optimization. - Architectural Innovations in Embedded Multicore/Manycore SoCs
Focus: Novel core designs, memory hierarchies, and scalable architectures. - Design Methodologies for Embedded Multicore/Manycore SoCs
Focus: System-level design, modeling, and co-design strategies. - Interconnection Networks for Embedded Multicore/Manycore SoCs
Focus: NoC architectures, routing algorithms, and communication-aware design. - Testing, Security, and Trust in Embedded Multicore/Manycore Systems
Focus: Hardware security, fault tolerance, and trust verification. - Design Automation and Low-Power Techniques for Embedded Manycore SoCs
Focus: CAD tools, power-aware synthesis, and energy-efficient design flows. - Real-Time Systems for Embedded Multicore/Manycore SoCs
Focus: Scheduling, timing analysis, and predictability. - Operating System Platforms for Real-Time Embedded Applications
Focus: RTOS design, virtualization, and OS-level support. - Application Domains for Embedded Multicore/Manycore SoCs
Focus: Automotive, robotics, healthcare, and industrial use cases.
- Hardware Acceleration of AI on Embedded Edge SoCs
Focus: AI inference engines, edge deployment, and hardware-software co-design. - Machine Learning for Energy-Efficient and Reliable Manycore Systems
Focus: ML-based optimization, reliability modeling, and performance tuning. - Chiplet-Based Architectures and Design for Multicore SoCs
Focus: Modular integration, inter-chip communication, and scalable ecosystems. - Sustainable Design and Lifecycle Management for Multicore SoCs
Focus: Carbon-aware computing, energy harvesting, and recyclable materials. - Privacy-Preserving AI Acceleration on Embedded Multicore SoCs
Focus: Federated learning, homomorphic encryption, and trusted execution environments. - Formal Verification and Benchmarking of Multicore SoC Platforms
Focus: Model checking, simulation acceleration, and reproducible benchmarking. - Compiler Technologies and Toolchains for Embedded Multicore SoCs
Focus: Parallelizing compilers, DSLs, and toolchain co-design. - Multicore SoCs for Cyber-Physical and Autonomous Systems
Focus: Sensor fusion, control loops, safety-critical systems, and edge autonomy. - 2026 MCSoC-NeuroCore Global Summit on Neuromorphic Systems and Brain‑Inspired Computing
Focus: Neuromorphic Engineering; Cognitive Architectures; SNNs; Edge Intelligence.
Special Sessions
| Special Session on Performance Optimization and Auto-Tuning (POAT2026) Focus: Auto-tuning techniques, performance modeling, and code optimization. |
Special Session on Emerging ML and Deep Learning Models Focus: Advanced DL architectures, theoretical foundations, and novel applications. |
| Special Session on Cutting-Edge Emerging Applications Focus: Smart cities, Industry 4.0, and next-generation embedded solutions. |
Harnessing AI Tools for Transforming Education Focus: EdTech innovation, AI in classrooms, and personalized learning. |
| Special Session on Embedded Applications and Ubiquitous Computing Focus: Pervasive computing, context-aware systems, and mobile applications. |
Special Session on Embedded ML and Data Analytics Focus: Edge analytics, real-time data processing, and lightweight ML models. |
| Special Session on Embedded, Cyber-Physical, and IoT Systems Focus: CPS architecture, sensor networks, and secure IoT integration. |
Special Session on Embedded Biomedical Engineering Focus: Wearable devices, health monitoring, and bio-signal processing. |
| Digital Accessibility through AI and ML Focus: Assistive technology, inclusive design, and AI for accessibility. |
Parallel/Distributed, Grid, and Cloud Computing Focus: Cloud-edge continuum, high-performance computing, and distributed systems. |
| Special Session on Mechatronics & Neuroprosthesis Focus: Robotics, human-machine interfaces, and assistive technologies. |
Distributed Computing for Emerging AI Applications Focus: Federated learning, multi-agent systems, and decentralized AI. |
| Special Session on Quantum Technology and ML Focus: Quantum algorithms, quantum machine learning, and hybrid computing. |
Intelligent Systems and Learning Technologies Focus: Adaptive learning, educational AI, and smart tutoring systems. |
| Optical Communications, Devices and Networking Focus: Optical networks, photonics, and high-speed data transmission. |
Special Session on Emerging Tech and Sustainability Focus: Green computing, energy-efficient design, and eco-friendly technology. |
Proceedings Publication and Indexing
Indexed by
Published in
The conference proceedings, including all technical tracks, special tracks, special sessions, and workshop papers, will be published by IEEE Conference Proceedings. These will be included in the Computer Society Digital Library (CSDL) and IEEE Xplore, subject to meeting IEEE Xplore’s scope and quality requirements.
All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, ISI Thomson’s Scientific and Tech. Pro. Scopus, and ISTP/ISI Proceedings.
